Bourns LF2250MM25

表面安装

YES

终端数量

120

Package Description

QFP, QFP120,1.2SQ,32

Package Style

FLATPACK

Moisture Sensitivity Levels

3

Package Body Material

CERAMIC

Package Equivalence Code

QFP120,1.2SQ,32

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

LF2250MM25

Package Code

QFP

Package Shape

SQUARE

Manufacturer

LOGIC Devices Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

LOGIC DEVICES INC

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

DSP外设

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-XQFP-G120

资历状况

不合格

电源

5 V

温度等级

MILITARY

uPs/uCs/外围ICs类型

GRAPHICS PROCESSOR