Chengdu Sino Microelectronics Technology Co Ltd HWD2190ITL

表面安装

YES

终端数量

9

Dielectric strength

2500 (50 Hz / 1 min) V

Operating ambient temperature

-20…+50 (non-condensing) °C

Load voltage

~440 V

Part Life Cycle Code

接触制造商

Ihs Manufacturer

CHENGDU SINO MICROELECTRONICS TECHNOLOGY CO LTD

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA9,3X3,20

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Transport packaging size/quantity

39.5*29.5*19/100

Gross weight

93.50

ECCN 代码

EAR99

类型

Single-phase solid-state relay series SSR-1

HTS代码

8542.33.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

深度

57.4 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B9

资历状况

不合格

温度等级

INDUSTRIAL

Insulation resistance

1000 (at Uisп .dc = 500V) MΩ min

Leakage current

20-50 mA

电源电流-最大值

10 mA

Control mode

R - with instantaneous (random) turn-on

消费者集成电路类型

音频放大器

Load current

10 A

Control voltage

3...32 (DC) V

Switching time

10 ms max

高度

28 (without cover) mm

宽度

44.8 mm