CML Innovative Technologies CMX838E1.

表面安装

YES

材料

Plastic

终端数量

28

Pitch thread

1.5

Surface protection

Untreated

Glass-fibre reinforced

无

For Ex-Zone dust

None

Thread length

15

Degree of protection (IP)

IP68

Explosion-tested version

无

Suitable for cable diameter

2 - 5

With locknut

无

Thread type

Metric

With strain relief

无

Nominal thread size metric/PG

12

Wrench width

15

Material quality

Polyamide (PA)

Bend radius protection/trumpet flare

无

For Ex-zone gas

None

Shock resistant

无

Model

Straight

Package Description

TSSOP, TSSOP28,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP28,.25

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CMX838E1

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

CML Microcircuits Plc

Part Life Cycle Code

活跃

Ihs Manufacturer

CML MICROCIRCUITS LTD

Risk Rank

5.26

Part Package Code

SSOP

JESD-609代码

e3

无铅代码

有

端子表面处理

Matte Tin (Sn)

HTS代码

8542.39.00.01

子类别

其他电信集成电路

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.65 mm

Reach合规守则

compliant

引脚数量

28

JESD-30代码

R-PDSO-G28

资历状况

不合格

电源

3/5.5 V

温度等级

INDUSTRIAL

电源电流-最大值

0.03 mA

座位高度-最大

1.2 mm

通信IC类型

电信电路

宽度

4.4 mm

长度

9.7 mm