Cypress Semiconductor CY62167ESL-55FNXI

表面安装

YES

终端数量

60

Manufacturer Part Number

CY62167ESL-55FNXI

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

VFBGA,

Risk Rank

5.71

Access Time-Max

55 ns

Number of Words

1048576 words

Number of Words Code

1000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

附加功能

IT ALSO OPERATES AT 3V AND 5V NOMINAL SUPPLY

HTS代码

8542.32.00.41

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.55 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B60

电源电压-最大值(Vsup)

1.95 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.65 V

操作模式

ASYNCHRONOUS

组织结构

1MX16

座位高度-最大

0.568 mm

内存宽度

16

记忆密度

16777216 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM

长度

5.814 mm

宽度

4.654 mm