Cypress Semiconductor CY8C4024FNI-S412

表面安装

YES

终端数量

25

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

WLCSP-25

Date Of Intro

2016-02-16

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Equivalence Code

BGA25,5X5,14

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Min

1.8 V

Supply Voltage-Nom

3.3 V

JESD-609代码

e1

ECCN 代码

3A991.A.3

端子表面处理

锡银铜

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.35 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B25

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

PROGRAMMABLE SoC

座位高度-最大

0.482 mm

长度

2.022 mm

宽度

1.932 mm