参数名
参数值
参数名
参数值
表面安装
YES
引脚数
35
终端数量
35
ECCN (US)
3A991.a.3
Family Name
CY8Cxxx
Instruction Set Architecture
RISC
Maximum CPU Frequency (MHz)
24
Maximum Clock Rate (MHz)
24
Data Bus Width (bit)
32
Programmability
有
Interface Type
I2C/SPI/UART
Number of I/Os
31
No. of Timers
5
Timers Resolution (bit)
16/16/16/16/16
Number of ADCs
Dual
ADC Resolution (bit)
10/12
Number of DAC's
Single
USART
0
UART
1
I2C
1
I2S
0
Watchdog
1
Analog Comparators
2
Parallel Master Port
无
Real Time Clock
无
Minimum Operating Supply Voltage (V)
1.8
Typical Operating Supply Voltage (V)
5|2.5|3.3
Maximum Operating Supply Voltage (V)
5.5
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
CECC Qualified
无
Standard Package Name
BGA
Supplier Package
WLCSP
Mounting
表面贴装
Package Height
0.31(Max)
Package Length
2.58
Package Width
2.1
PCB changed
35
Lead Shape
Ball
Package Description
VFBGA, BGA35,5X7,14
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA35,5X7,14
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
3.3 V
Supply Voltage-Min
1.71 V
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
CY8C4125FNI-S423
Clock Frequency-Max
48 MHz
Package Code
VFBGA
Package Shape
RECTANGULAR
Manufacturer
赛普拉斯半导体
Part Life Cycle Code
活跃
Number of I/O Lines
31
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Supply Voltage-Max
5.5 V
Risk Rank
5.6
包装
Tray
零件状态
活跃
ECCN 代码
3A991.A.3
HTS代码
8542.31.00.01
技术
CMOS
端子位置
BOTTOM
终端形式
BALL
端子间距
0.35 mm
Reach合规守则
compliant
JESD-30代码
R-PBGA-B35
温度等级
INDUSTRIAL
内存大小
4KB
uPs/uCs/外围ICs类型
多功能外围设备
程序存储器类型
Flash
程序内存大小
32KB
电源电流-最大值
6.85 mA
数模转换器通道
2
座位高度-最大
0.482 mm
核心架构
ARM
边界扫描
NO
内存(字)
2048
以太网
0
USB
0
总线兼容性
I2C; IDE; IRDA; LIN; SPI; UART
SPI,SPI
1
CAN
0
脉宽调制
5
ADC Channels
16
设备核心
ARM Cortex M0+
宽度
2.097 mm
长度
2.582 mm
RoHS状态
符合RoHS标准