参数名
参数值
参数名
参数值
表面安装
YES
引脚数
35
终端数量
35
Maximum CPU Frequency (MHz)
48
Maximum Clock Rate (MHz)
48
Data Bus Width (bit)
32
Programmability
有
Interface Type
I2C/SPI/UART
Number of I/Os
31
No. of Timers
5
Timers Resolution (bit)
16/16/16/16/16
Number of ADCs
Dual
ADC Resolution (bit)
10/12
Number of DAC's
Single
USART
0
UART
1
Supplier Package
WLCSP
Mounting
表面贴装
Package Height
0.31(Max)
Package Length
2.58
Package Width
2.1
PCB changed
35
Lead Shape
Ball
I2C
1
I2S
0
Watchdog
1
Analog Comparators
2
Parallel Master Port
无
Real Time Clock
无
Minimum Operating Supply Voltage (V)
1.8
Typical Operating Supply Voltage (V)
5|2.5|3.3
Maximum Operating Supply Voltage (V)
5.5
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
CECC Qualified
无
Standard Package Name
BGA
ECCN (US)
3A991.a.3
Family Name
CY8Cxxx
Instruction Set Architecture
RISC
Package Description
WLCSP-35
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Moisture Sensitivity Levels
1
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA35,5X7,14
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
3.3 V
Supply Voltage-Min
1.71 V
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
CY8C4146FNI-S433
Clock Frequency-Max
48 MHz
Package Code
VFBGA
Package Shape
RECTANGULAR
Manufacturer
赛普拉斯半导体
Part Life Cycle Code
活跃
Number of I/O Lines
31
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Supply Voltage-Max
5.5 V
Risk Rank
5.6
包装
Tray
零件状态
活跃
ECCN 代码
3A991.A.3
HTS代码
8542.31.00.01
技术
CMOS
端子位置
BOTTOM
终端形式
BALL
端子间距
0.35 mm
Reach合规守则
compliant
JESD-30代码
R-PBGA-B35
温度等级
INDUSTRIAL
内存大小
8KB
uPs/uCs/外围ICs类型
多功能外围设备
程序存储器类型
Flash
程序内存大小
64KB
电源电流-最大值
6.85 mA
数模转换器通道
2
座位高度-最大
0.482 mm
核心架构
ARM
边界扫描
NO
内存(字)
4096
以太网
0
USB
0
总线兼容性
I2C; IDE; IRDA; LIN; SPI; UART
SPI,SPI
1
CAN
0
脉宽调制
5
ADC Channels
16
设备核心
ARM Cortex M0+
宽度
2.097 mm
长度
2.582 mm
RoHS状态
符合RoHS标准