参数名
参数值
参数名
参数值
表面安装
YES
终端数量
68
Maximum Expanded Memory Size
4GB
Programmability
有
Interface Type
I2C/SPI/UART
Number of I/Os
46
No. of Timers
4
Number of ADCs
Single
ADC Resolution (bit)
12
Number of DAC's
Dual
DAC Resolution (bit)
8/8
USART
0
UART
1
I2C
1
I2S
0
Watchdog
1
Analog Comparators
4
Parallel Master Port
无
Real Time Clock
有
Special Features
液晶控制器
Minimum Operating Supply Voltage (V)
1.71|1.8
Typical Operating Supply Voltage (V)
5|1.8|3.3
Maximum Operating Supply Voltage (V)
1.89|5.5
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
CECC Qualified
无
Standard Package Name
QFN
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
67
Maximum CPU Frequency (MHz)
67
Instruction Set Architecture
RISC
Family Name
CY8Cxxx
Supplier Package
QFN EP
Mounting
表面贴装
Package Height
0.88
Package Length
8
Package Width
8
PCB changed
68
Lead Shape
No Lead
Package Description
QFN-68
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Moisture Sensitivity Levels
3
Package Body Material
UNSPECIFIED
Package Equivalence Code
BGA99,9X11,20
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
1.8 V
Reflow Temperature-Max (s)
30
Supply Voltage-Min
1.71 V
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
CY8C5466LTI-LP072
Clock Frequency-Max
33 MHz
Package Code
HVQCCN
Package Shape
SQUARE
Manufacturer
赛普拉斯半导体
Part Life Cycle Code
活跃
Number of I/O Lines
48
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
Supply Voltage-Max
5.5 V
Risk Rank
5.73
Part Package Code
QFN
JESD-609代码
e4
零件状态
活跃
端子表面处理
Nickel/Palladium/Gold (Ni/Pd/Au)
HTS代码
8542.39.00.01
子类别
Other uPs/uCs/Peripheral ICs
技术
CMOS
端子位置
QUAD
终端形式
无铅
峰值回流焊温度(摄氏度)
260
端子间距
0.4 mm
Reach合规守则
compliant
引脚数量
68
JESD-30代码
S-XQCC-N68
资历状况
不合格
电源
2/5 V
温度等级
INDUSTRIAL
内存大小
16KB
程序存储器类型
Flash
程序内存大小
64KB
座位高度-最大
1 mm
核心架构
ARM
边界扫描
YES
内存(字)
8192
以太网
0
USB
0
总线兼容性
I2C; USB; PS/2
SPI,SPI
1
CAN
0
脉宽调制
1
可擦除紫外线
N
只读存储器大小(位)
524288 Bits
设备核心
ARM Cortex M3
宽度
8 mm
长度
8 mm
RoHS状态
符合RoHS标准