Cypress Semiconductor CYNCP80192-BGC

表面安装

YES

终端数量

388

Package Description

BGA, BGA388,26X26,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA388,26X26,50

Operating Temperature-Max

70 °C

Manufacturer Part Number

CYNCP80192-BGC

Package Code

BGA

Package Shape

SQUARE

Manufacturer

赛普拉斯半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Risk Rank

5.79

子类别

Microprocessors

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B388

资历状况

不合格

电源

2.5,3.3 V

温度等级

COMMERCIAL