Cypress Semiconductor S29GL064A10FAIR30

表面安装

YES

终端数量

64

Type of wire

data transmission

Cable structure

12x2x28AWG

Core structure

stranded

Kind of core

Cu

Core marking

colours without colour repetition

Shield structure

Al-PET foil,

Wire insulation material

PVC

Cable features

twisted pair conductors

Package contents

30.5m

Cable external diameter

6.4mm

Earth core

none

Version

Splice Free

Gross weight

2525.8 g

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

13 X 11 MM, FBGA-64

Access Time-Max

100 ns

Number of Words

4194304 words

Number of Words Code

4000000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE

Supply Voltage-Nom (Vsup)

3.3 V

Operating temperature

max. 75°C

JESD-609代码

e0

ECCN 代码

EAR99

类型

NOR型号

端子表面处理

锡铅

HTS代码

8542.32.00.51

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B64

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

3 V

操作模式

ASYNCHRONOUS

组织结构

4MX16

座位高度-最大

1.4 mm

内存宽度

16

记忆密度

67108864 bit

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

3 V

Rated voltage

50V

备用内存宽度

8

Number of cores

24

引导模块

TOP

Core diameter

28AWG

饱和电流

3

长度

13 mm

宽度

11 mm