Dataman BU-65171S6-392

表面安装

NO

终端数量

70

Manufacturer Part Number

BU-65171S6-392

Part Life Cycle Code

活跃

Ihs Manufacturer

DATA DEVICE CORP

Part Package Code

PGA

Package Description

DIP, SPGA70,7X35MOD

Risk Rank

5.24

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

DIP

Package Equivalence Code

SPGA70,7X35MOD

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

70

JESD-30代码

R-CDIP-T70

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

地址总线宽度

16

边界扫描

NO

低功率模式

YES

外部数据总线宽度

16

串行I/O数

2

最大数据传输率

0.125 MBps

通信协议

MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838

数据编码/解码方式

BIPH-LEVEL(MANCHESTER)