Device Engineering Incorporated DEI1026A-SES-G

Contact plating

gold-plated

表面安装

YES

Number of pins

30

终端数量

16

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x30

Gross weight

2.58 g

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

DEVICE ENGINEERING INC

Part Package Code

SOIC

Package Description

SOP,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP16,.25

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Operating temperature

-40...163°C

JESD-609代码

e4

无铅代码

有

ECCN 代码

EAR99

端子表面处理

镍钯金

性别

GENERAL PURPOSE

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

6

端子间距

1.27 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

40

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

OTHER

座位高度-最大

1.7272 mm

差分输出

NO

输入特性

STANDARD

接口IC类型

LINE DRIVER

驱动程序位数

6

传输延迟-最大值

150 ns

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

9.906 mm

宽度

3.89 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0