Dialog DA9063-00HO2

表面安装

YES

终端数量

100

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

5000

Manufacturer

Dialog Semiconductor

Brand

Dialog Semiconductor

RoHS

Details

Package Description

TFBGA, BGA100,10X10,32

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA100,10X10,32

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

DA9063-00HO2

Supply Voltage-Nom (Vsup)

3.6 V

Package Code

TFBGA

Package Shape

SQUARE

Part Life Cycle Code

活跃

Ihs Manufacturer

DIALOG SEMICONDUCTOR GMBH

Risk Rank

5.68

包装

Reel

子类别

PMIC - Power Management ICs

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B100

电源电压-最大值(Vsup)

5.5 V

温度等级

AUTOMOTIVE

通道数量

33

模拟 IC - 其他类型

电源管理电路

可调阈值

YES

座位高度-最大

1.2 mm

产品类别

Power Management Specialized - PMIC

产品类别

Power Management Specialized - PMIC

宽度

8 mm

长度

8 mm