Dialog Semiconductor GmbH IW1696C-01

表面安装

YES

终端数量

5

Part Life Cycle Code

Obsolete

Ihs Manufacturer

DIALOG SEMICONDUCTOR GMBH

Package Description

TSOP, TSOP5/6,.11,37

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP

Package Equivalence Code

TSOP5/6,.11,37

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.95 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G5

资历状况

不合格

控制模式

CURRENT-MODE