Fairchild Semiconductor Corporation BCW29

表面安装

YES

材料

ABC plastic

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

FAIRCHILD SEMICONDUCTOR CORP

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

小概要

Gross Weight

44.50

Transport packaging size/quantity

53*19*37/200

Interaxial distance

127.5 mm

Type of bridge rectifier

three-phase

Max. off-state voltage

0.8kV

Max. forward impulse current

1kA

Electrical mounting

screw

Version

module - slim

Max. forward voltage

1.6V

Leads

M5 screws

Case

PWS-D flat

Mechanical mounting

screw

Kind of package

bulk

Related items

B5X8/BN1719

Features of semiconductor devices

glass passivated

JESD-609代码

e0

ECCN 代码

EAR99

类型

grille fan series KPG 180 x 180

端子表面处理

锡铅

颜色

black

端子位置

DUAL

终端形式

鸥翼

Reach合规守则

unknown

JESD-30代码

R-PDSO-G3

资历状况

不合格

配置

SINGLE

极性/通道类型

PNP

Hole diameter

mounting hole - 5.0

最大耗散功率(Abs)

0.3 W

Load current

100A

数量

5 inner rings

集电极电流-最大值(IC)

0.1 A

最小直流增益（hFE）

120

集电极-发射器电压-最大值

20 V

高度

154 mm

宽度

154 mm