Freescale MC68451L8F

表面安装

NO

终端数量

64

Factory Pack QuantityFactory Pack Quantity

3

Manufacturer

Sensata

Brand

AIRPAX

Package Description

DIP, DIP64,.9

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP64,.9

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MC68451L8F

Package Code

DIP

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

断路器

技术

MOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T64

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

内存管理单元

产品类别

断路器