Freescale Semiconductor MC10164L

表面安装

NO

材料

synthetic polyolefin

终端数量

16

Protected wire (cable) diameter

0.75…0.9 mm

Diameter before shrinkage

1.5 mm

Diameter after shrinkage

0.65 mm

Wall thickness before shrinkage

0.15 mm

Wall thickness after shrinkage

0.28 mm

Shrinkage temperature

+70…+120 °C

Gross weight

1.82

Transport packaging size/quantity

102*20*20/1000

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

包装

in packs of 1 m lengths

JESD-609代码

e0

类型

Heat-shrink tubing without adhesive

端子表面处理

Tin/Lead (Sn/Pb)

颜色

red

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

-5.2 V

温度等级

OTHER

输入数量

8

Operating temperature range

-55…+125 °C

逻辑IC类型

MULTIPLEXER

Prop. Delay@Nom-Sup

6.7 ns

电源电流-最大值(ICC)

83 mA

Shrinkage ratio

2 : 1

Operating voltage

600 V