Freescale Semiconductor MC1231L

表面安装

NO

终端数量

14

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP14,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Package Description

DIP, DIP14,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

温度等级

MILITARY

逻辑IC类型

XNOR门

施密特触发器

NO