Freescale Semiconductor MC14051BCP

表面安装

NO

材料

Copper + Manganin

终端数量

16

Transport packaging size/quantity

35*29*16/1

Gross weight

20900.00

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

On-state Resistance-Max (Ron)

135 Ω

Package Description

DIP, DIP16,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

Operating temperature

-40…+60 °C

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

通道数量

8

模拟 IC - 其他类型

SINGLE-ENDED MULTIPLEXER

开关量

BREAK-BEFORE-MAKE

信号电流-最大值

0.025 A

Accuracy class

0.5