Freescale Semiconductor MC14069UBCP

表面安装

NO

终端数量

14

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP14,.3

Load Capacitance (CL)

50 pF

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Gross weight

34.05

Transport packaging size/quantity

42*28*18.5/280

Installation hole size

Ф24 (to be modified to fit the housing profile) mm

Compatible parts

XLR插头

JESD-609代码

e0

类型

3-pin microphone jack for panel

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

深度

overall - 39 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

INVERTER

最大 I(ol)

0.0042 A

Prop. Delay@Nom-Sup

125 ns

施密特触发器

NO

特征

shielded design with push-pull mechanism

高度

35.5 mm

宽度

26.2 mm