Freescale Semiconductor MC141549P2

表面安装

NO

终端数量

16

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5 V

Gross Weight

0.39

Transport Package Size/Quantity

42*28*18.5/19710

操作温度

-40 …+125 °C

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

5 V

温度等级

OTHER

uPs/uCs/外围ICs类型

GRAPHICS PROCESSOR

保险丝类型

S1035 Series Fusible Insert

额定电流

30 A

额定电压

32 (DC) V