Freescale Semiconductor XPC862SRCZP66

表面安装

YES

终端数量

357

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

BGA, BGA357,19X19,50

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA357,19X19,50

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Nom

3.3 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B357

资历状况

不合格

电源

3.3 V