Freescale Semiconductor SN54LS112AJ

表面安装

NO

材料

synthetic polyolefin

终端数量

16

Diameter of protected wire (cable)

8.3…15 mm

Diameter before shrinkage

17.0 mm

Diameter after shrinkage

8.0 mm

Wall thickness before shrinkage

0.4 mm

Wall thickness after shrinkage

0.7 mm

Gross weight

19.60

Transport packaging size/quantity

102*20*20/500

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

包装

in packs of 1m lengths

JESD-609代码

e0

类型

Non-adhesive heat shrink tube

端子表面处理

Tin/Lead (Sn/Pb)

颜色

yellow

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

Operating temperature range

-55…+125 °C

逻辑IC类型

J-K FLIP-FLOP

最大 I(ol)

0.004 A

触发器类型

NEGATIVE EDGE

电源电流-最大值(ICC)

6 mA

Shrink temperature

+70…+120 °C

最大频率@Nom-Sup

30000000 Hz

Operating voltage

600 V

收缩率

2 : 1