Freescale Semiconductor SN54LS75J

表面安装

NO

终端数量

16

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP16,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Operating frequency range

up to 4 GHz

Number of connections/disconnections

≥500 cycles

Body diameter

14.7 mm

Gross weight

11.25

Transport packaging size/quantity

42*28*23.5/1000

JESD-609代码

e0

Connector type

Plug 2xBNC

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

深度

33.9 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5 V

温度等级

MILITARY

比特数

4

Operating temperature range

-65…+165 °C

逻辑IC类型

D 拉锁

最大 I(ol)

0.004 A

Prop. Delay@Nom-Sup

30 ns

电源电流-最大值(ICC)

12 mA