Freescale Semiconductor, Inc. (NXP Semiconductors) 54LS158/BFBJC

表面安装

YES

终端数量

16

Manufacturer Part Number

54LS158/BFBJC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DFP, FL16,.3

Risk Rank

5.92

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DFP

Package Equivalence Code

FL16,.3

Package Shape

RECTANGULAR

Package Style

FLATPACK

Supply Voltage-Nom (Vsup)

5 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

FLAT

功能数量

4

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

电源

5 V

温度等级

MILITARY

输入数量

2

逻辑IC类型

MULTIPLEXER

筛选水平

38535Q/M;38534H;883B