Fujitsu MB810AZ

表面安装

NO

终端数量

16

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MB810AZ

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

FUJITSU Limited

Part Life Cycle Code

活跃

Ihs Manufacturer

FUJITSU LTD

Risk Rank

5.81

Prop.

0.65 ns

Package Style

IN-LINE

Package Description

DIP, DIP16,.3

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

-5.2 V

温度等级

COMMERCIAL

逻辑IC类型

OR/NOR GATE

施密特触发器

NO

电源电流-最大值(ICC)

25 mA