Genesys GL850G-HHNXX

表面安装

YES

终端数量

28

Package Description

SSOP,

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3.15 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

GL850G-HHNXX

Clock Frequency-Max

48 MHz

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Genesys Logic Inc

Part Life Cycle Code

接触制造商

Ihs Manufacturer

GENESYS LOGIC INC

Supply Voltage-Max

3.45 V

Risk Rank

5.61

附加功能

ALSO REQUIRES 5V SUPPLY

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

JESD-30代码

R-PDSO-G28

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

2 mm

总线兼容性

USB; VBUS

最大数据传输率

60 MBps

宽度

5.3 mm

长度

10.2 mm

达到SVHC

unknown