GigaDevice GD25LQ64CVIG

表面安装

YES

终端数量

8

Stranding element

无

Permitted cable outer temperature after assembling without vibration

-40 - 80

Material core insulation

Polyvinyl chloride (PVC)

Colour outer sheath

Grey

Permitted cable outer temperature during assembling/handling

-20 - 80

Outer diameter approx.

18.6

Screen over stranding element

None

Core identification

Numbers

Nominal cross section conductor

1.5

Screen over stranding

None

Nominal voltage U0

300

Low smoke (according to EN 61034-2)

无

Min. permitted bending radius, moving application/free movement

140

Min. permitted bending radius, stationary application/permanent installation

75

Nominal voltage U

500

Material outer sheath

Polyurethane (PUR)

Conductor category

Class 5 = flexible

Package Description

VSOP-8

Package Style

SMALL OUTLINE, VERY THIN PROFILE

Number of Words Code

64000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

GD25LQ64CVIG

Clock Frequency-Max (fCLK)

133 MHz

Number of Words

67108864 words

Supply Voltage-Nom (Vsup)

1.8 V

Package Code

VSOP

Package Shape

SQUARE

Manufacturer

GigaDevice Semiconductor (Beijing) Inc

Part Life Cycle Code

接触制造商

Ihs Manufacturer

GIGADEVICE SEMICONDUCTOR INC

Risk Rank

5.74

ECCN 代码

3A991.B.1.A

类型

NOR型号

HTS代码

8542.32.00.51

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

1.27 mm

JESD-30代码

S-PDSO-G8

电源电压-最大值(Vsup)

2 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

组织结构

64MX1

座位高度-最大

1 mm

内存宽度

1

记忆密度

67108864 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

宽度

5.28 mm

长度

5.28 mm

达到SVHC

unknown