Hammond Manufacturing 1558/BPBJC

表面安装

NO

终端数量

8

Manufacturer Part Number

1558/BPBJC

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP8,.3

Risk Rank

5.92

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP8,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

15 V

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T8

资历状况

不合格

电源

+-15 V

温度等级

MILITARY

建筑学

VOLTAGE-FEEDBACK

放大器类型

OPERATIONAL AMPLIFIER

负电源电压(Vsup)

-15 V

低偏移

NO

频率补偿

YES

筛选水平

38535Q/M;38534H;883B

输入失调电压-最大值

6000 µV