HARRIS HGTP3N60C3DR

表面安装

NO

终端数量

3

晶体管元件材料

SILICON

Package Description

FLANGE MOUNT, R-PSFM-T3

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Turn-on Time-Nom (ton)

5 ns

Turn-off Time-Nom (toff)

325 ns

Manufacturer Part Number

HGTP3N60C3DR

Risk Rank

5.58

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Part Life Cycle Code

Transferred

Number of Elements

1

Manufacturer

Harris Semiconductor

Package Shape

RECTANGULAR

附加功能

LOW CONDUCTION LOSS, HYPER FAST RECOVERY

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-PSFM-T3

资历状况

不合格

配置

SINGLE WITH BUILT-IN DIODE

箱体转运

COLLECTOR

晶体管应用

MOTOR CONTROL

极性/通道类型

N-CHANNEL

JEDEC-95代码

TO-220AB

集电极电流-最大值(IC)

6 A

集电极-发射器电压-最大值

600 V