HITACHI HM62256BLSP-7

表面安装

NO

终端数量

28

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

32000

Package Body Material

PLASTIC/EPOXY

Access Time-Max

70 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

HM62256BLSP-7

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

接触制造商

Ihs Manufacturer

RENESAS TECHNOLOGY CORP

Risk Rank

5.66

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

unknown

JESD-30代码

R-PDIP-T28

电源电压-最大值(Vsup)

5.5 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

32KX8

内存宽度

8

记忆密度

262144 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM