Holtek HT8950

表面安装

NO

终端数量

18

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP18,.3

Package Code

DIP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-20 °C

Operating Temperature-Max

70 °C

Risk Rank

8.79

Ihs Manufacturer

HOLTEK SEMICONDUCTOR INC

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

HT8950

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T18

资历状况

不合格

电源

3 V

温度等级

COMMERCIAL

电源电流-最大值

10 mA