Holtek HT9170

表面安装

NO

材料

Copper

终端数量

18

Surface protection

Tinned

For cables resistant to short circuit

无

With identification flag

无

Reel/roll packaging

无

Nominal cross section

1.5

Construction type

Standard

Sleeve length

8

Risk Rank

5.73

Ihs Manufacturer

HOLTEK SEMICONDUCTOR INC

Part Life Cycle Code

活跃

Manufacturer

Holtek Semiconductor Inc

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

HT9170

Operating Temperature-Max

70 °C

Operating Temperature-Min

-20 °C

Package Equivalence Code

DIP18,.3

Package Body Material

PLASTIC/EPOXY

Package Style

IN-LINE

Package Description

DIP, DIP18,.3

子类别

电信信令电路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T18

资历状况

不合格

电源

3/5 V

温度等级

COMMERCIAL

电源电流-最大值

7 mA

通信IC类型

DTMF信号电路

绝缘的

有