Holtek Semiconductor Inc HT82M33A

表面安装

NO

终端数量

18

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HOLTEK SEMICONDUCTOR INC

Package Description

DIP, DIP18,.3

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP18,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T18

资历状况

不合格

温度等级

OTHER

uPs/uCs/外围ICs类型

微处理器电路

电源电流-最大值

3 mA