IDT 7M204S100CB

表面安装

NO

终端数量

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Number of Words Code

4000

Package Body Material

CERAMIC

Package Equivalence Code

DIP28,.6

Operating Temperature-Min

-55 °C

Reflow Temperature-Max (s)

30

Access Time-Max

100 ns

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

7M204S100CB

Clock Frequency-Max (fCLK)

8 MHz

Number of Words

4096 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.92

Usage Level

Military grade

JESD-609代码

e0

无铅代码

无

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.32.00.71

子类别

FIFOs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

225

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-XDIP-T28

资历状况

不合格

电源

5 V

温度等级

MILITARY

操作模式

ASYNCHRONOUS

电源电流-最大值

0.23 mA

组织结构

4KX9

内存宽度

9

记忆密度

36864 bit

筛选水平

MIL-STD-883 Class B (Modified)

内存IC类型

其他先进先出