Infineon BSM10GD60DN2

表面安装

NO

终端数量

17

晶体管元件材料

SILICON

Manufacturer Part Number

BSM10GD60DN2

Manufacturer

Infineon

Package Description

FLANGE MOUNT, R-XUFM-T17

Package Style

FLANGE MOUNT

Package Body Material

UNSPECIFIED

Turn-on Time-Nom (ton)

40 ns

Turn-off Time-Nom (toff)

250 ns

Operating Temperature-Max

125 °C

Turn-on Time-Max (ton)

80 ns

Package Shape

RECTANGULAR

Risk Rank

5.73

Turn-off Time-Max (toff)

370 ns

Ihs Manufacturer

西门子 A G

Part Life Cycle Code

Obsolete

Number of Elements

6

端子位置

UPPER

终端形式

THROUGH-HOLE

Reach合规守则

unknown

JESD-30代码

R-XUFM-T17

资历状况

不合格

配置

BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE

箱体转运

ISOLATED

极性/通道类型

N-CHANNEL

集电极电流-最大值(IC)

10 A

集电极-发射器电压-最大值

600 V

栅极-发射极电压-最大值

20 V

VCEsat-最大值

2.7 V

栅极-发射极Thr电压-最大值

6.5 V

环境耗散-最大值

210 W