Integrated Device Technology ICS932S421BGLF

表面安装

YES

终端数量

56

Package Description

6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-56

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP56,.3,20

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

ICS932S421BGLF

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.75

JESD-609代码

e3

无铅代码

有

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn) - annealed

HTS代码

8542.39.00.01

子类别

时钟发生器

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-G56

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, OTHER

电源电流-最大值

350 mA