Integrated Device Technology ICS9FG1201HFLFT

表面安装

YES

终端数量

56

Package Description

SSOP,

Package Style

SMALL OUTLINE, SHRINK PITCH

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

3.135 V

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

ICS9FG1201HFLF-T

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltage-Max

3.465 V

Risk Rank

5.32

Part Package Code

SSOP

JESD-609代码

e3

无铅代码

有

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn) - annealed

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.635 mm

Reach合规守则

compliant

引脚数量

56

JESD-30代码

R-PDSO-G56

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, PROCESSOR SPECIFIC

座位高度-最大

2.8 mm

主时钟/晶体频率-名

400 MHz

输出时钟频率-最大值

400 MHz

宽度

7.5 mm

长度

18.43 mm