Integrated Device Technology IDT77V011L155DA

表面安装

YES

终端数量

144

Package Description

20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, QFP-144

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

IDT77V011L155DA

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code

QFP

Risk Rank

5.85

Supply Voltage-Max

3.6 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn85Pb15)

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

not_compliant

引脚数量

144

JESD-30代码

S-PQFP-G144

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

1.7 mm

接口IC类型

电路接口

宽度

20 mm

长度

20 mm