Integrated Device Technology (IDT) 79R3001-25F

表面安装

YES

终端数量

172

Manufacturer Part Number

79R3001-25F

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.92

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

QFF

Package Equivalence Code

QFL172,1.2SQ,25

Package Shape

SQUARE

Package Style

FLATPACK

Supply Voltage-Nom

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

QUAD

终端形式

FLAT

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

S-XQFP-F172

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

速度

25 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

750 mA

位元大小

32