Integrated Device Technology (IDT) 79RC32V332-100DHI

表面安装

YES

终端数量

208

Manufacturer Part Number

79RC32V332-100DHI

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code

QFP

Package Description

FQFP, QFP208,1.2SQ,20

Risk Rank

5.77

Reflow Temperature-Max (s)

20

Supply Voltage-Nom

3.3 V

Supply Voltage-Max

3.465 V

Package Style

FLATPACK, FINE PITCH

Package Shape

SQUARE

Package Equivalence Code

QFP208,1.2SQ,20

Package Code

FQFP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Moisture Sensitivity Levels

3

Supply Voltage-Min

3.135 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn85Pb15)

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

225

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

208

JESD-30代码

S-PQFP-G208

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

速度

100 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

480 mA

位元大小

32

座位高度-最大

4.1 mm

长度

28 mm

宽度

28 mm