Integrated Device Technology (IDT) 89H48H12G2ZABLG
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89H48H12G2ZABLG
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89H48H12G2ZABLG datasheet pdf and Integrated Circuits (ICs) product details from Integrated Device Technology (IDT) stock available at utmel
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89H48H12G2ZABLG详情
Integrated Device Technology (IDT) 89H48H12G2ZABLG重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
终端数量
676
Manufacturer Part Number
89H48H12G2ZABLG
Rohs Code
有
Part Life Cycle Code
活跃
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Risk Rank
5.77
Operating Temperature-Max
70 °C
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA676,26X26,40
Package Shape
SQUARE
Package Style
网格排列
端子位置
BOTTOM
终端形式
BALL
端子间距
1 mm
Reach合规守则
compliant
JESD-30代码
S-PBGA-B676
资历状况
不合格
电源
1,2.5,2.5/3.3 V
温度等级
COMMERCIAL
电源电流-最大值
2689 mA
89H48H12G2ZABLG拓展信息
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)







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