Integrated Device Technology (IDT) 9LPRS545BGLF

表面安装

YES

终端数量

48

Manufacturer Part Number

9LPRS545BGLF

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code

TSSOP

Package Description

6.10 MM, 0.50 MM PITCH, MO-153, TSSOP-48

Risk Rank

5.64

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Max

3.465 V

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

3.135 V

HTS代码

8542.31.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

48

JESD-30代码

R-PDSO-G48

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1.2 mm

长度

12.5 mm

宽度

6.1 mm