Integrated Device Technology (IDT) CA91L8200B-100CL

表面安装

YES

终端数量

504

Manufacturer Part Number

CA91L8200B-100CL

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TUNDRA SEMICONDUCTOR CORP

Package Description

27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, MO-151, HSBGA-504

Risk Rank

5.59

Clock Frequency-Max

100 MHz

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, HEAT SINK/SLUG

Supply Voltage-Max

2.63 V

Supply Voltage-Nom

2.5 V

Supply Voltage-Min

2.38 V

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B504

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

2.36 mm

地址总线宽度

32

外部数据总线宽度

64

总线兼容性

MPC8260; POWERPC 603E; POWERPC 7400; POWERPC 740; POWERPC 750

长度

27 mm

宽度

27 mm