Integrated Device Technology (IDT) HN62444BCP
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HN62444BCP
1179-HN62444BCP
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HN62444BCP datasheet pdf and Integrated Circuits (ICs) product details from Integrated Device Technology (IDT) stock available at utmel
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HN62444BCP详情
Integrated Device Technology (IDT) HN62444BCP重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
终端数量
44
Manufacturer Part Number
HN62444BCP
Part Life Cycle Code
Transferred
Ihs Manufacturer
HITACHI LTD
Part Package Code
LCC
Package Description
QCCJ,
Risk Rank
5.16
Access Time-Max
100 ns
Number of Words
262144 words
Number of Words Code
256000
Operating Temperature-Max
70 °C
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Supply Voltage-Nom (Vsup)
5 V
ECCN 代码
EAR99
HTS代码
8542.32.00.71
端子位置
QUAD
终端形式
J BEND
功能数量
1
端子间距
1.27 mm
Reach合规守则
unknown
引脚数量
44
JESD-30代码
S-PQCC-J44
资历状况
不合格
电源电压-最大值(Vsup)
5.25 V
温度等级
COMMERCIAL
电源电压-最小值(Vsup)
4.75 V
操作模式
ASYNCHRONOUS
组织结构
256KX16
座位高度-最大
4.57 mm
内存宽度
16
记忆密度
4194304 bit
并行/串行
PARALLEL
内存IC类型
MASK ROM
长度
16.5862 mm
宽度
16.5862 mm
HN62444BCP拓展信息
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)







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