Integrated Device Technology (IDT) ICS2509CGLF
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ICS2509CGLF
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ICS2509CGLF datasheet pdf and Integrated Circuits (ICs) product details from Integrated Device Technology (IDT) stock available at utmel
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ICS2509CGLF详情
Integrated Device Technology (IDT) ICS2509CGLF重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
24
Manufacturer Part Number
ICS2509CGLF
Rohs Code
有
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
TSSOP, TSSOP24,.25
Risk Rank
5.84
Operating Temperature-Max
70 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Equivalence Code
TSSOP24,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup)
3.3 V
端子位置
DUAL
终端形式
鸥翼
端子间距
0.635 mm
Reach合规守则
unknown
JESD-30代码
R-PDSO-G24
资历状况
不合格
电源
3.3 V
温度等级
COMMERCIAL
最大 I(ol)
0.008 A
ICS2509CGLF拓展信息
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)







哦! 它是空的。