Integrated Device Technology (IDT) ICS9220YGLF-T

表面安装

YES

终端数量

28

Manufacturer Part Number

ICS9220YGLF-T

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code

TSSOP

Package Description

4.40 MM, 0.65 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-28

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

2.5 V

Supply Voltage-Max

2.625 V

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Shape

RECTANGULAR

Package Code

TSSOP

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

70 °C

Risk Rank

5.84

Supply Voltage-Min

2.375 V

JESD-609代码

e3

无铅代码

有

ECCN 代码

EAR99

端子表面处理

哑光锡

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.65 mm

Reach合规守则

compliant

引脚数量

28

JESD-30代码

R-PDSO-G28

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, PROCESSOR SPECIFIC

座位高度-最大

1.2 mm

宽度

4.4 mm

长度

9.7 mm