Integrated Device Technology (IDT) IDTQS316209PA8
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IDTQS316209PA8
1179-IDTQS316209PA8
集成电路(IC)
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大陆
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TSSOP,
1最小包装量--
IDTQS316209PA8详情
Integrated Device Technology (IDT) IDTQS316209PA8重要参数规格及、参数值,及相似型号如下:
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- 参数名参数值全选
表面安装
YES
终端数量
48
Manufacturer Part Number
IDTQS316209PA8
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TSSOP
Package Description
TSSOP,
Risk Rank
5.63
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup)
5 V
JESD-609代码
e0
端子表面处理
锡铅
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
鸥翼
功能数量
2
端子间距
0.5 mm
Reach合规守则
unknown
引脚数量
48
JESD-30代码
R-PDSO-G48
资历状况
不合格
电源电压-最大值(Vsup)
5.5 V
温度等级
INDUSTRIAL
电源电压-最小值(Vsup)
4.5 V
端口的数量
4
比特数
9
输出特性
3-STATE
座位高度-最大
1.2 mm
输出极性
TRUE
逻辑IC类型
总线交换机
传播延迟(tpd)
0.25 ns
长度
12.5 mm
宽度
6.1 mm
IDTQS316209PA8拓展信息
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)
Integrated Device Technology (IDT)







哦! 它是空的。