Integrated Silicon Solution, Inc. (ISSI) IS61C512-15NI

表面安装

NO

终端数量

32

Manufacturer Part Number

IS61C512-15NI

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

INTEGRATED CIRCUIT SOLUTION INC

Package Description

DIP, DIP32,.3

Risk Rank

5.85

Access Time-Max

15 ns

Number of Words

65536 words

Number of Words Code

64000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP32,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T32

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

操作模式

ASYNCHRONOUS

组织结构

64KX8

输出特性

3-STATE

内存宽度

8

记忆密度

524288 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM

待机电压-最小值

4.5 V