Integrated Silicon Solution, Inc. (ISSI) IS62LV2568LL-70TI

表面安装

YES

终端数量

32

Manufacturer Part Number

IS62LV2568LL-70TI

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

INTEGRATED CIRCUIT SOLUTION INC

Package Description

TSSOP, TSSOP32,.8,20

Risk Rank

5.88

Access Time-Max

70 ns

Number of Words

262144 words

Number of Words Code

256000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP32,.8,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G32

资历状况

不合格

电源

3/3.3 V

温度等级

INDUSTRIAL

操作模式

ASYNCHRONOUS

电源电流-最大值

0.035 mA

组织结构

256KX8

输出特性

3-STATE

内存宽度

8

记忆密度

2097152 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM

待机电压-最小值

1.5 V